03634nam a22004097a 4500 SNU 20160510231811.0 160413b xxu||||| |||| 00| 0 eng d 9780120885749 Global Information Systems Technology Pvt Ltd 877, Udhyog Vihar, Phase-V, Gurgaon 621.381 OHR Ohring, Milton, 1936- Reliability and failure of electronic materials and devices / Milton Ohring & Lucian Kasprzak. Amsterdam ; Elsevier/Academic Press, ©2015 xxiv, 734 pages : illustrations ; 24 cm. Chapter 1 - An Overview of Electronic Devices and Their Reliability, http://www.sciencedirect.com/science/article/pii/B978012088574900001X Chapter 2 - Electronic Devices: How They Operate and Are Fabricated, http://www.sciencedirect.com/science/article/pii/B9780120885749000021 Chapter 3 - Defects, Contaminants, and Yield, http://www.sciencedirect.com/science/article/pii/B9780120885749000033 Chapter 4 - The Mathematics of Failure and Reliability, http://www.sciencedirect.com/science/article/pii/B9780120885749000045 Chapter 5 - Mass Transport-Induced Failure, http://www.sciencedirect.com/science/article/pii/B9780120885749000057 Chapter 6 - Electronic Charge-Induced Damage, http://www.sciencedirect.com/science/article/pii/B9780120885749000069 Chapter 7 - Environmental Damage to Electronic Products, http://www.sciencedirect.com/science/article/pii/B9780120885749000070 Chapter 8 - Packaging Materials, Processes, and Stresses, http://www.sciencedirect.com/science/article/pii/B9780120885749000082 Chapter 9 - Degradation of Contacts and Package Interconnections, http://www.sciencedirect.com/science/article/pii/B9780120885749000094 Chapter 10 - Degradation and Failure of Electro-Optical Materials and Devices, http://www.sciencedirect.com/science/article/pii/B9780120885749000100 Chapter 11 - Characterization and Failure Analysis of Materials and Devices, http://www.sciencedirect.com/science/article/pii/B9780120885749000112 Chapter 12 - Future Directions and Reliability Issues, http://www.sciencedirect.com/science/article/pii/B9780120885749000124 "Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices http://www.sciencedirect.com/science/book/9780120885749 Electronic apparatus and appliances Reliability. System failures (Engineering) Packaging Materials Electronic Charge-Induced Damage E-Books Kasprzak, Lucian. E-Book http://www.sciencedirect.com/science/book/9780120885749 ddc ER 45969 45969 0 0 ddc Document, Internet resource 0 1 REF SNUL SNUL 2016-05-10 Science Direct®, (Elsevier) 13650.00 0 621.381 OHR ER30 2016-05-10 00:00:00 2016-05-10 ER