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  <titleInfo>
    <title>Reliability and failure of electronic materials and devices</title>
  </titleInfo>
  <name type="personal">
    <namePart>Ohring, Milton</namePart>
    <namePart type="date">1936-</namePart>
    <role>
      <roleTerm authority="marcrelator" type="text">creator</roleTerm>
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  <name type="personal">
    <namePart>Kasprzak, Lucian.</namePart>
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    <place>
      <placeTerm type="text">Amsterdam</placeTerm>
    </place>
    <publisher>Elsevier/Academic Press</publisher>
    <dateIssued>©2015</dateIssued>
    <issuance>monographic</issuance>
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  <language>
    <languageTerm authority="iso639-2b" type="code">eng</languageTerm>
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    <extent>xxiv, 734 pages : illustrations ; 24 cm.</extent>
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  <abstract xmlns:xlink="http://www.w3.org/1999/xlink" xlink:href="http://www.sciencedirect.com/science/book/9780120885749">"Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices</abstract>
  <tableOfContents xmlns:xlink="http://www.w3.org/1999/xlink" xlink:href="http://www.sciencedirect.com/science/article/pii/B978012088574900001X">Chapter 1 - An Overview of Electronic Devices and Their Reliability,</tableOfContents>
  <tableOfContents xmlns:xlink="http://www.w3.org/1999/xlink" xlink:href="http://www.sciencedirect.com/science/article/pii/B9780120885749000021">Chapter 2 - Electronic Devices: How They Operate and Are Fabricated, </tableOfContents>
  <tableOfContents xmlns:xlink="http://www.w3.org/1999/xlink" xlink:href="http://www.sciencedirect.com/science/article/pii/B9780120885749000033">Chapter 3 - Defects, Contaminants, and Yield, </tableOfContents>
  <tableOfContents xmlns:xlink="http://www.w3.org/1999/xlink" xlink:href="http://www.sciencedirect.com/science/article/pii/B9780120885749000045">Chapter 4 - The Mathematics of Failure and Reliability, </tableOfContents>
  <tableOfContents xmlns:xlink="http://www.w3.org/1999/xlink" xlink:href="http://www.sciencedirect.com/science/article/pii/B9780120885749000057">Chapter 5 - Mass Transport-Induced Failure, </tableOfContents>
  <tableOfContents xmlns:xlink="http://www.w3.org/1999/xlink" xlink:href="http://www.sciencedirect.com/science/article/pii/B9780120885749000069">Chapter 6 - Electronic Charge-Induced Damage, </tableOfContents>
  <tableOfContents xmlns:xlink="http://www.w3.org/1999/xlink" xlink:href="http://www.sciencedirect.com/science/article/pii/B9780120885749000070">Chapter 7 - Environmental Damage to Electronic Products, </tableOfContents>
  <tableOfContents xmlns:xlink="http://www.w3.org/1999/xlink" xlink:href="http://www.sciencedirect.com/science/article/pii/B9780120885749000082">Chapter 8 - Packaging Materials, Processes, and Stresses, </tableOfContents>
  <tableOfContents xmlns:xlink="http://www.w3.org/1999/xlink" xlink:href="http://www.sciencedirect.com/science/article/pii/B9780120885749000094">Chapter 9 - Degradation of Contacts and Package Interconnections, </tableOfContents>
  <tableOfContents xmlns:xlink="http://www.w3.org/1999/xlink" xlink:href="http://www.sciencedirect.com/science/article/pii/B9780120885749000100">Chapter 10 - Degradation and Failure of Electro-Optical Materials and Devices, </tableOfContents>
  <tableOfContents xmlns:xlink="http://www.w3.org/1999/xlink" xlink:href="http://www.sciencedirect.com/science/article/pii/B9780120885749000112">Chapter 11 - Characterization and Failure Analysis of Materials and Devices,  Chapter 12 - Future Directions and Reliability Issues, http://www.sciencedirect.com/science/article/pii/B9780120885749000124</tableOfContents>
  <note type="statement of responsibility">Milton Ohring &amp; Lucian Kasprzak.</note>
  <subject>
    <topic>Electronic apparatus and appliances</topic>
  </subject>
  <subject>
    <topic>Reliability</topic>
  </subject>
  <subject>
    <topic>System failures (Engineering)</topic>
  </subject>
  <subject>
    <topic>Packaging Materials</topic>
  </subject>
  <subject>
    <topic>Electronic Charge-Induced Damage</topic>
  </subject>
  <subject>
    <topic>E-Books</topic>
  </subject>
  <classification authority="ddc">621.381 OHR</classification>
  <identifier type="isbn">9780120885749</identifier>
  <identifier type="">Global Information Systems Technology  Pvt Ltd 877, Udhyog Vihar, Phase-V, Gurgaon</identifier>
  <identifier type="uri">http://www.sciencedirect.com/science/book/9780120885749</identifier>
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    <recordCreationDate encoding="marc">160413</recordCreationDate>
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