<![CDATA[SNU Library Search for 'su:"Packaging."']]>

<![CDATA[SNU Library Search for 'su:"Packaging."']]> https://library.snu.edu.in/cgi-bin/koha/opac-search.pl?q=ccl=su%3A%22Packaging.%22&sort_by=&format=rss 53 0 50 Print and production finishes for packaging. ISBN:9782940361977 https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=10548 ]]> By ; Denison,Edward..
,Mies , Rotovision SA 2008 .
188 p. ; 27 cm..
9782940361977

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]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=10548 Packaging design ISBN:9783037681398 https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=10554 ]]> By ; Uffelen, Chris van..
,Salenstein : Braun 2013 .
240 pages ; 29 cm.
9783037681398

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]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=10554 Color Management : A Comprehensive Guide for Graphic Designers ISBN:9782940361670 https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=10586 ]]> Switzerland ; RotoVision 2008 .
220 p. 28 cm..
9782940361670

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]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=10586 MEMS and Microsystems: Wafer Bonding & Packaging of MEMS ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=25771 By Kal, Santiram.
Kharagpur Indian Insitiute of Technology

]]> Place hold on MEMS and Microsystems:

]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=25771 MEMS and Microsystems: Wafer Bonding & Packaging of MEMS ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=29864 By Kal, Santiram.
Kharagpur Indian Insitiute of Technology

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]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=29864 Fundamentals of microfabrication : the science of miniaturization ISBN:9780849308260 https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=32993 ]]> By Madou, Marc J..
Boca Raton, Fla. CRC Press 2002 .
723 p. ; 29 cm..
9780849308260

]]> Place hold on Fundamentals of microfabrication

]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=32993 An Introduction to Electronics Systems Packaging: Introduction and Objectives of the course ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34576 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

]]> Place hold on An Introduction to Electronics Systems Packaging:

]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34576 An Introduction to Electronics Systems Packaging: Definition of a system and history of semiconductors ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34577 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

]]> Place hold on An Introduction to Electronics Systems Packaging:

]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34577 An Introduction to Electronics Systems Packaging: Products and levels of packaging ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34578 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

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]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34578 An Introduction to Electronics Systems Packaging: Packaging aspects of handheld products; Case studies in applications ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34579 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

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]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34579 An Introduction to Electronics Systems Packaging: "Case Study (continued); Definition of PWB, summary and Questions for review" ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34580 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

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]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34580 An Introduction to Electronics Systems Packaging: Basics of Semiconductor and Process flowchart; Video on �Sand-to-Silicon� ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34581 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

]]> Place hold on An Introduction to Electronics Systems Packaging:

]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34581 An Introduction to Electronics Systems Packaging: "Wafer fabrication, inspection and testing" ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34582 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

]]> Place hold on An Introduction to Electronics Systems Packaging:

]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34582 An Introduction to Electronics Systems Packaging: Wafer packaging; Packaging evolution; Chip connection choices ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34583 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

]]> Place hold on An Introduction to Electronics Systems Packaging:

]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34583 An Introduction to Electronics Systems Packaging: "Wire bonding, TAB and flipchip-1" ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34584 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

]]> Place hold on An Introduction to Electronics Systems Packaging:

]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34584 An Introduction to Electronics Systems Packaging: "Wire bonding, TAB and flipchip-2; Tutorials" ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34585 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

]]> Place hold on An Introduction to Electronics Systems Packaging:

]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34585 An Introduction to Electronics Systems Packaging: Why packaging? & Single chip packages or modules (SCM) ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34586 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

]]> Place hold on An Introduction to Electronics Systems Packaging:

]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34586 An Introduction to Electronics Systems Packaging: Commonly used packages and advanced packages; Materials in packages ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34587 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

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]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34587 An Introduction to Electronics Systems Packaging: Advances packages (continued); Thermal mismatch in packages; Current trends in packaging ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34588 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

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]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34588 An Introduction to Electronics Systems Packaging: Multichip modules (MCM)-types; System-in-package (SIP); Packaging roadmaps; Hybrid circuits; Quiz on packages ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34589 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

]]> Place hold on An Introduction to Electronics Systems Packaging:

]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34589 An Introduction to Electronics Systems Packaging: Electrical Issues � I; Resistive Parasitic ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34590 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

]]> Place hold on An Introduction to Electronics Systems Packaging:

]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34590 An Introduction to Electronics Systems Packaging: Electrical Issues � II; Capacitive and Inductive Parasitic ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34591 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

]]> Place hold on An Introduction to Electronics Systems Packaging:

]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34591 An Introduction to Electronics Systems Packaging: Electrical Issues � III; Layout guidelines and the Reflection problem ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34592 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

]]> Place hold on An Introduction to Electronics Systems Packaging:

]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34592 An Introduction to Electronics Systems Packaging: Electrical Issues � IV; Interconnection ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34593 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

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]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34593 An Introduction to Electronics Systems Packaging: "Quick Tutorial on packages; Benefits from CAD; Introduction to DFM, DFR & DFT" ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34594 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

]]> Place hold on An Introduction to Electronics Systems Packaging:

]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34594 An Introduction to Electronics Systems Packaging: Components of a CAD package and its highlights ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34595 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

]]> Place hold on An Introduction to Electronics Systems Packaging:

]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34595 An Introduction to Electronics Systems Packaging: Design Flow considerations; Beginning a circuit design with schematic work and component layout ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34596 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

]]> Place hold on An Introduction to Electronics Systems Packaging:

]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34596 An Introduction to Electronics Systems Packaging: Demo and examples of layout and routing; Technology file generation from CAD; DFM check list and design rules; Design for Reliability ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34597 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

]]> Place hold on An Introduction to Electronics Systems Packaging:

]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34597 An Introduction to Electronics Systems Packaging: Review of CAD output files for PCB fabrication; Photo plotting and mask generation ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34598 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

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]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34598 An Introduction to Electronics Systems Packaging: Process flow-chart; Vias; PWB substrates ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34599 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

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]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34599 An Introduction to Electronics Systems Packaging: Substrates continued; Video highlights; Surface preparation ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34600 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

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]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34600 An Introduction to Electronics Systems Packaging: Photoresist and application methods; UV exposure and developing; Printing technologies for PWBs ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34601 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

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]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34601 An Introduction to Electronics Systems Packaging: PWB etching; Resist stripping; Screen-printing technology ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34602 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

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]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34602 An Introduction to Electronics Systems Packaging: Through-hole manufacture process steps; Panel and pattern plating methods ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34603 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

]]> Place hold on An Introduction to Electronics Systems Packaging:

]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34603 An Introduction to Electronics Systems Packaging: Video highlights on manufacturing; Solder mask for PWBs; Multilayer PWBs; Introduction to microvias ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34604 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

]]> Place hold on An Introduction to Electronics Systems Packaging:

]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34604 An Introduction to Electronics Systems Packaging: Microvia technology and Sequential build-up technology process flow for high-density interconnects ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34605 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

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]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34605 An Introduction to Electronics Systems Packaging: Conventional Vs HDI technologies; Flexible circuits; Tutorial session ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34606 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

]]> Place hold on An Introduction to Electronics Systems Packaging:

]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34606 An Introduction to Electronics Systems Packaging: SMD benefits; Design issues; Introduction to soldering ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34607 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

]]> Place hold on An Introduction to Electronics Systems Packaging:

]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34607 An Introduction to Electronics Systems Packaging: Reflow and Wave Soldering methods to attach SMDs ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34608 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

]]> Place hold on An Introduction to Electronics Systems Packaging:

]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34608 An Introduction to Electronics Systems Packaging: Solders; Wetting of solders; Flux and its properties; Defects in wave soldering ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34609 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

]]> Place hold on An Introduction to Electronics Systems Packaging:

]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34609 An Introduction to Electronics Systems Packaging: "Vapour phase soldering, BGA soldering and Desoldering/Repair; SMT failures" ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34610 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

]]> Place hold on An Introduction to Electronics Systems Packaging:

]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34610 An Introduction to Electronics Systems Packaging: SMT failure library and Tin Whiskers ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34611 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

]]> Place hold on An Introduction to Electronics Systems Packaging:

]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34611 An Introduction to Electronics Systems Packaging: Tin-lead and lead-free solders; Phase diagrams; Thermal profiles for reflow soldering; Lead-free alloys ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34612 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

]]> Place hold on An Introduction to Electronics Systems Packaging:

]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34612 An Introduction to Electronics Systems Packaging: Lead-free solder considerations; Green electronics; RoHS compliance and e-waste recycling issues ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34613 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

]]> Place hold on An Introduction to Electronics Systems Packaging:

]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34613 An Introduction to Electronics Systems Packaging: Thermal Design considerations in systems packaging ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34614 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

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]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34614 An Introduction to Electronics Systems Packaging: Introduction to embedded passives; Need for embedded passives; Design Library; Embedded resistor processes ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34615 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

]]> Place hold on An Introduction to Electronics Systems Packaging:

]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34615 An Introduction to Electronics Systems Packaging: Embedded capacitors; Processes for embedding capacitors; Case study examples; Summary of materials in packaging ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34616 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

]]> Place hold on An Introduction to Electronics Systems Packaging:

]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34616 An Introduction to Electronics Systems Packaging: Chapter-wise summary ISBN: https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34617 By "Mahesh, G.V.".
Bangalore Indian Insitiute of Science

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]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=34617 MEMS and microsystems : design and manufacture ISBN:9788126525805 https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=38364 ]]> By Hsu, Tai-Ran.
Boston : McGraw-Hill 2002 .
xii, 436 p. ; 24 cm..
9788126525805

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]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=38364 Small Outline Package Guide. ISBN:296514004 https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=41047 By ; Intel Corporation..
USA : Intel Corporation 1994 .
various pages. :24cm..
296514004

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]]> https://library.snu.edu.in/cgi-bin/koha/opac-detail.pl?biblionumber=41047