000			03634nam a22004097a 4500
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020			_a9780120885749
028			_aGlobal Information Systems Technology Pvt Ltd _b877, Udhyog Vihar, Phase-V, Gurgaon
082			_a621.381 OHR
100			_aOhring, Milton, _d1936-
245			_aReliability and failure of electronic materials and devices / _cMilton Ohring & Lucian Kasprzak.
260			_aAmsterdam ; _bElsevier/Academic Press, _c©2015
300			_axxiv, 734 pages : _billustrations ; _c24 cm.
505			_aChapter 1 - An Overview of Electronic Devices and Their Reliability, _uhttp://www.sciencedirect.com/science/article/pii/B978012088574900001X
505			_aChapter 2 - Electronic Devices: How They Operate and Are Fabricated, _uhttp://www.sciencedirect.com/science/article/pii/B9780120885749000021
505			_aChapter 3 - Defects, Contaminants, and Yield, _uhttp://www.sciencedirect.com/science/article/pii/B9780120885749000033
505			_aChapter 4 - The Mathematics of Failure and Reliability, _uhttp://www.sciencedirect.com/science/article/pii/B9780120885749000045
505			_aChapter 5 - Mass Transport-Induced Failure, _uhttp://www.sciencedirect.com/science/article/pii/B9780120885749000057
505			_aChapter 6 - Electronic Charge-Induced Damage, _uhttp://www.sciencedirect.com/science/article/pii/B9780120885749000069
505			_aChapter 7 - Environmental Damage to Electronic Products, _uhttp://www.sciencedirect.com/science/article/pii/B9780120885749000070
505			_aChapter 8 - Packaging Materials, Processes, and Stresses, _uhttp://www.sciencedirect.com/science/article/pii/B9780120885749000082
505			_aChapter 9 - Degradation of Contacts and Package Interconnections, _uhttp://www.sciencedirect.com/science/article/pii/B9780120885749000094
505			_aChapter 10 - Degradation and Failure of Electro-Optical Materials and Devices, _uhttp://www.sciencedirect.com/science/article/pii/B9780120885749000100
505			_aChapter 11 - Characterization and Failure Analysis of Materials and Devices, _uhttp://www.sciencedirect.com/science/article/pii/B9780120885749000112 _gChapter 12 - Future Directions and Reliability Issues, http://www.sciencedirect.com/science/article/pii/B9780120885749000124
520			_a"Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices _uhttp://www.sciencedirect.com/science/book/9780120885749
650			_aElectronic apparatus and appliances _2
650			_aReliability.
650			_aSystem failures (Engineering)
650			_aPackaging Materials
650			_aElectronic Charge-Induced Damage
650			_aE-Books
700			_aKasprzak, Lucian.
856			_3E-Book _uhttp://www.sciencedirect.com/science/book/9780120885749
942			_2ddc _cER
999			_c45969 _d45969