Reliability and failure of electronic materials and devices / Milton Ohring & Lucian Kasprzak.
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TextPublisher number: Global Information Systems Technology Pvt Ltd | 877, Udhyog Vihar, Phase-V, GurgaonPublication details: Amsterdam ; Elsevier/Academic Press, ©2015Description: xxiv, 734 pages : illustrations ; 24 cmISBN: 9780120885749Subject(s): Electronic apparatus and appliances | Reliability | System failures (Engineering) | Packaging Materials | Electronic Charge-Induced Damage | E-BooksDDC classification: 621.381 OHR Online resources: E-Book | Item type | Current library | Collection | Call number | Status | Date due | Barcode | Item holds |
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Electronic Resources (E-Books)
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SNU LIBRARY | Reference | 621.381 OHR (Browse shelf(Opens below)) | Not For Loan | ER30 |
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Chapter 1 - An Overview of Electronic Devices and Their Reliability,
http://www.sciencedirect.com/science/article/pii/B978012088574900001X
Chapter 2 - Electronic Devices: How They Operate and Are Fabricated,
http://www.sciencedirect.com/science/article/pii/B9780120885749000021
Chapter 3 - Defects, Contaminants, and Yield,
http://www.sciencedirect.com/science/article/pii/B9780120885749000033
Chapter 4 - The Mathematics of Failure and Reliability,
http://www.sciencedirect.com/science/article/pii/B9780120885749000045
Chapter 5 - Mass Transport-Induced Failure,
http://www.sciencedirect.com/science/article/pii/B9780120885749000057
Chapter 6 - Electronic Charge-Induced Damage,
http://www.sciencedirect.com/science/article/pii/B9780120885749000069
Chapter 7 - Environmental Damage to Electronic Products,
http://www.sciencedirect.com/science/article/pii/B9780120885749000070
Chapter 8 - Packaging Materials, Processes, and Stresses,
http://www.sciencedirect.com/science/article/pii/B9780120885749000082
Chapter 9 - Degradation of Contacts and Package Interconnections,
http://www.sciencedirect.com/science/article/pii/B9780120885749000094
Chapter 10 - Degradation and Failure of Electro-Optical Materials and Devices,
http://www.sciencedirect.com/science/article/pii/B9780120885749000100
Chapter 11 - Characterization and Failure Analysis of Materials and Devices, Chapter 12 - Future Directions and Reliability Issues, http://www.sciencedirect.com/science/article/pii/B9780120885749000124
http://www.sciencedirect.com/science/article/pii/B9780120885749000112
"Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices
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