Normal view MARC view ISBD view

MEMS and Microsystems:

Kal, Santiram

MEMS and Microsystems: Wafer Bonding & Packaging of MEMS / Santiram Kal - Kharagpur Indian Insitiute of Technology - Video Lecture - NPTEL Lecture Series Electronics And Communication Engineering Wafer Bonding & Packaging of MEMS .

Subjects--Topical Terms:
Electronics And Communication Engineering
IIT Kharagpur
MEMS and Microsystems
NPTEL
Prof. Santiram Kal
Wafer Bonding & Packaging of MEMS

Place hold
Print
Cite
Add to your cart (remove)
Save record
BIBTEX Dublin Core MARCXML MARC (non-Unicode/MARC-8) MARC (Unicode/UTF-8) MARC (Unicode/UTF-8, Standard) MODS (XML) RIS
More searches

Search for this title in:
Other Libraries (WorldCat) Other Databases (Google Scholar) Online Stores (Bookfinder.com)