An Introduction to Electronics Systems Packaging: Microvia technology and Sequential build-up technology process flow for high-density interconnects / G.V. Mahesh
Material type:
Computer fileSeries: NPTEL Lecture Series. Electrical Engineering Microvia technology and Sequential build-up technology process flow for high-density interconnectsPublication details: Bangalore Indian Insitiute of ScienceDescription: Video LectureSubject(s): Online resources:
| Item type | Current library | Status | |
|---|---|---|---|
NPTEL SNU
|
SNU LIBRARY | Available |
Total holds: 0
There are no comments on this title.
Log in to your account to post a comment.
