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14001.
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An Introduction to Electronics Systems Packaging: Introduction and Objectives of the course / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Introduction and Objectives of the course
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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14002.
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An Introduction to Electronics Systems Packaging: Definition of a system and history of semiconductors / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Definition of a system and history of semiconductors
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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14003.
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An Introduction to Electronics Systems Packaging: Products and levels of packaging / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Products and levels of packaging
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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14004.
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An Introduction to Electronics Systems Packaging: Packaging aspects of handheld products; Case studies in applications / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Packaging aspects of handheld products; Case studies in applications
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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14005.
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An Introduction to Electronics Systems Packaging: "Case Study (continued); Definition of PWB, summary and Questions for review" / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering "Case Study (continued); Definition of PWB, summary and Questions for review"
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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14006.
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An Introduction to Electronics Systems Packaging: Basics of Semiconductor and Process flowchart; Video on �Sand-to-Silicon� / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Basics of Semiconductor and Process flowchart; Video on �Sand-to-Silicon�
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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14007.
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An Introduction to Electronics Systems Packaging: "Wafer fabrication, inspection and testing" / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering "Wafer fabrication, inspection and testing"
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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14008.
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An Introduction to Electronics Systems Packaging: Wafer packaging; Packaging evolution; Chip connection choices / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Wafer packaging; Packaging evolution; Chip connection choices
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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14009.
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An Introduction to Electronics Systems Packaging: "Wire bonding, TAB and flipchip-1" / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering "Wire bonding, TAB and flipchip-1"
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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14010.
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An Introduction to Electronics Systems Packaging: "Wire bonding, TAB and flipchip-2; Tutorials" / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering "Wire bonding, TAB and flipchip-2; Tutorials"
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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14011.
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An Introduction to Electronics Systems Packaging: Why packaging? & Single chip packages or modules (SCM) / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Why packaging? & Single chip packages or modules (SCM)
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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14012.
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An Introduction to Electronics Systems Packaging: Commonly used packages and advanced packages; Materials in packages / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Commonly used packages and advanced packages; Materials in packages
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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14013.
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An Introduction to Electronics Systems Packaging: Advances packages (continued); Thermal mismatch in packages; Current trends in packaging / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Advances packages (continued); Thermal mismatch in packages; Current trends in packaging
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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14014.
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An Introduction to Electronics Systems Packaging: Multichip modules (MCM)-types; System-in-package (SIP); Packaging roadmaps; Hybrid circuits; Quiz on packages / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Multichip modules (MCM)-types; System-in-package (SIP); Packaging roadmaps; Hybrid circuits; Quiz on packages
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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14015.
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An Introduction to Electronics Systems Packaging: Electrical Issues � I; Resistive Parasitic / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Electrical Issues � I; Resistive Parasitic
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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14016.
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An Introduction to Electronics Systems Packaging: Electrical Issues � II; Capacitive and Inductive Parasitic / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Electrical Issues � II; Capacitive and Inductive Parasitic
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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14017.
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An Introduction to Electronics Systems Packaging: Electrical Issues � III; Layout guidelines and the Reflection problem / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Electrical Issues � III; Layout guidelines and the Reflection problem
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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14018.
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An Introduction to Electronics Systems Packaging: Electrical Issues � IV; Interconnection / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Electrical Issues � IV; Interconnection
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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14019.
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An Introduction to Electronics Systems Packaging: "Quick Tutorial on packages; Benefits from CAD; Introduction to DFM, DFR & DFT" / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering "Quick Tutorial on packages; Benefits from CAD; Introduction to DFM, DFR & DFT"
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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14020.
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An Introduction to Electronics Systems Packaging: Components of a CAD package and its highlights / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Components of a CAD package and its highlights
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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