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2121.
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An Introduction to Electronics Systems Packaging: "Wire bonding, TAB and flipchip-2; Tutorials" / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering "Wire bonding, TAB and flipchip-2; Tutorials"
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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2122.
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An Introduction to Electronics Systems Packaging: Why packaging? & Single chip packages or modules (SCM) / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Why packaging? & Single chip packages or modules (SCM)
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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2123.
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An Introduction to Electronics Systems Packaging: Commonly used packages and advanced packages; Materials in packages / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Commonly used packages and advanced packages; Materials in packages
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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2124.
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An Introduction to Electronics Systems Packaging: Advances packages (continued); Thermal mismatch in packages; Current trends in packaging / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Advances packages (continued); Thermal mismatch in packages; Current trends in packaging
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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2125.
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An Introduction to Electronics Systems Packaging: Multichip modules (MCM)-types; System-in-package (SIP); Packaging roadmaps; Hybrid circuits; Quiz on packages / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Multichip modules (MCM)-types; System-in-package (SIP); Packaging roadmaps; Hybrid circuits; Quiz on packages
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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2126.
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An Introduction to Electronics Systems Packaging: Electrical Issues � I; Resistive Parasitic / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Electrical Issues � I; Resistive Parasitic
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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2127.
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An Introduction to Electronics Systems Packaging: Electrical Issues � II; Capacitive and Inductive Parasitic / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Electrical Issues � II; Capacitive and Inductive Parasitic
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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2128.
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An Introduction to Electronics Systems Packaging: Electrical Issues � III; Layout guidelines and the Reflection problem / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Electrical Issues � III; Layout guidelines and the Reflection problem
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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2129.
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An Introduction to Electronics Systems Packaging: Electrical Issues � IV; Interconnection / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Electrical Issues � IV; Interconnection
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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2130.
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An Introduction to Electronics Systems Packaging: "Quick Tutorial on packages; Benefits from CAD; Introduction to DFM, DFR & DFT" / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering "Quick Tutorial on packages; Benefits from CAD; Introduction to DFM, DFR & DFT"
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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2131.
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An Introduction to Electronics Systems Packaging: Components of a CAD package and its highlights / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Components of a CAD package and its highlights
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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2132.
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An Introduction to Electronics Systems Packaging: Design Flow considerations; Beginning a circuit design with schematic work and component layout / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Design Flow considerations; Beginning a circuit design with schematic work and component layout
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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2133.
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An Introduction to Electronics Systems Packaging: Demo and examples of layout and routing; Technology file generation from CAD; DFM check list and design rules; Design for Reliability / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Demo and examples of layout and routing; Technology file generation from CAD; DFM check list and design rules; Design for Reliability
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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2134.
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An Introduction to Electronics Systems Packaging: Review of CAD output files for PCB fabrication; Photo plotting and mask generation / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Review of CAD output files for PCB fabrication; Photo plotting and mask generation
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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2135.
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An Introduction to Electronics Systems Packaging: Process flow-chart; Vias; PWB substrates / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Process flow-chart; Vias; PWB substrates
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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2136.
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An Introduction to Electronics Systems Packaging: Substrates continued; Video highlights; Surface preparation / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Substrates continued; Video highlights; Surface preparation
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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2137.
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An Introduction to Electronics Systems Packaging: Photoresist and application methods; UV exposure and developing; Printing technologies for PWBs / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Photoresist and application methods; UV exposure and developing; Printing technologies for PWBs
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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2138.
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An Introduction to Electronics Systems Packaging: PWB etching; Resist stripping; Screen-printing technology / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering PWB etching; Resist stripping; Screen-printing technology
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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2139.
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An Introduction to Electronics Systems Packaging: Through-hole manufacture process steps; Panel and pattern plating methods / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Through-hole manufacture process steps; Panel and pattern plating methods
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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2140.
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An Introduction to Electronics Systems Packaging: Video highlights on manufacturing; Solder mask for PWBs; Multilayer PWBs; Introduction to microvias / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Video highlights on manufacturing; Solder mask for PWBs; Multilayer PWBs; Introduction to microvias
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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