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41.
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An Introduction to Electronics Systems Packaging: "Vapour phase soldering, BGA soldering and Desoldering/Repair; SMT failures" / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering "Vapour phase soldering, BGA soldering and Desoldering/Repair; SMT failures"
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
Online resources:
Availability: Items available for loan: SNU LIBRARY (1).

42.
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An Introduction to Electronics Systems Packaging: SMT failure library and Tin Whiskers / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering SMT failure library and Tin Whiskers
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
Online resources:
Availability: Items available for loan: SNU LIBRARY (1).

43.
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An Introduction to Electronics Systems Packaging: Tin-lead and lead-free solders; Phase diagrams; Thermal profiles for reflow soldering; Lead-free alloys / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Tin-lead and lead-free solders; Phase diagrams; Thermal profiles for reflow soldering; Lead-free alloys
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
Online resources:
Availability: Items available for loan: SNU LIBRARY (1).

44.
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An Introduction to Electronics Systems Packaging: Lead-free solder considerations; Green electronics; RoHS compliance and e-waste recycling issues / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Lead-free solder considerations; Green electronics; RoHS compliance and e-waste recycling issues
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
Online resources:
Availability: Items available for loan: SNU LIBRARY (1).

45.
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An Introduction to Electronics Systems Packaging: Thermal Design considerations in systems packaging / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Thermal Design considerations in systems packaging
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
Online resources:
Availability: Items available for loan: SNU LIBRARY (1).

46.
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An Introduction to Electronics Systems Packaging: Introduction to embedded passives; Need for embedded passives; Design Library; Embedded resistor processes / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Introduction to embedded passives; Need for embedded passives; Design Library; Embedded resistor processes
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
Online resources:
Availability: Items available for loan: SNU LIBRARY (1).

47.
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An Introduction to Electronics Systems Packaging: Embedded capacitors; Processes for embedding capacitors; Case study examples; Summary of materials in packaging / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Embedded capacitors; Processes for embedding capacitors; Case study examples; Summary of materials in packaging
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
Online resources:
Availability: Items available for loan: SNU LIBRARY (1).

48.
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An Introduction to Electronics Systems Packaging: Chapter-wise summary / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Chapter-wise summary
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
Online resources:
Availability: Items available for loan: SNU LIBRARY (1).

49.
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MEMS and microsystems : design and manufacture /Tai-Ran Hsu by
Material type: Text Text; Format: print ; Literary form: Not fiction
Publisher number:
  • S.R. Books Distributors 12 Satyam Enclave,Tejab Mill Compound, G.T. Road Ghaziabad.
Publication details: Boston : McGraw-Hill , ©2002
Availability: Items available for loan: SNU LIBRARY (3)Call number: 621.381 HSU, ...

50.
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Small Outline Package Guide. /Intel Corporation. by
Material type: Text Text; Format: print ; Literary form: Not fiction
Publisher number:
  • ;HCL
Publication details: USA : Intel Corporation ,1994
Availability: Not available: SNU LIBRARY: Withdrawn (1).

51.
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Packaging Outlines and Dimensions / Intel by
Material type: Text Text; Format: print ; Literary form: Not fiction
Publisher number:
  • HCL
Publication details: USA ; Intel Corporation , 1987
Availability: Not available: SNU LIBRARY: Withdrawn (1).

52.
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Reliability and failure of electronic materials and devices / Milton Ohring & Lucian Kasprzak. by
Material type: Text Text; Format: print ; Literary form: Not fiction
Publisher number:
  • Global Information Systems Technology Pvt Ltd 877, Udhyog Vihar, Phase-V, Gurgaon
Publication details: Amsterdam ; Elsevier/Academic Press, ©2015
Online resources:
Availability: Items available for reference: SNU LIBRARY: Not For Loan (1)Call number: 621.381 OHR.

53.
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Biobased Polymers : properties and applications in packaging / Pratima Bajpai by
Material type: Text Text; Format: print ; Literary form: Not fiction
Publisher number:
  • :International Book Distributors :Flat No 17, Prakash Apartment 4405/2, 5 Ansari Road Darya Ganj New Delhi
Publication details: Amsterdam, Netherlands : Elsevier, 2019
Availability: Items available for reference: SNU LIBRARY: Not For Loan (1)Call number: 572.33 BAJ.


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