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Thermal Management of Microelectronic Equipment / Lian -Tuu Yeh

By: Yeh, Lian.-TuuContributor(s): Yeh, Lian.-TuuMaterial type: Text

TextPublisher number: :Zafaa Books & Distributors | :313/56F 49A, Anand Nagar Inderlok Delhi 110035Publication details: New York : ASME, 2016Edition: 2nd EdDescription: xxx, 492p. 24cmISBN: 9780791861097Subject(s): Applied physics | Electronic apparatus and appliances -- Cooling | Microelectronics | Electronic apparatus and appliances -- Thermal properties | Heat -- Transmission | Semiconductors -- ProtectionDDC classification: 621.38104 YEH

Contents:

1 Introduction -- 2 Conduction -- 3 Convection -- 4 Radiation -- 5 Pool Boiling -- 6 Flow Boiling -- 7 Condensation -- 8 Extended Surfaces -- 9 Thermal Interface Resistance -- 10 Component and Printed Circuit Board -- 11 Direct Air Cooling and Fans -- 12 Natural and Mixed Convection -- 13 Heat Exchangers and Cold Plates -- 14 Advanced Cooling Technologies I: Single-Phase Liquid Cooling -- 15 Advanced Cooling Technologies II: Two-Phase Flow Cooling -- 16 Heat Pipes and Others -- 17 Thermoelectric Devices -- 18 Microwave Modules and GaAs Chips.

Summary: This Second Edition of a classic text is fully updated and greatly expanded, with in-depth revisions that include advancements in the component technology of microelectronics. The most noticeable one is the addition of an entirely new chapter on microwave modules and the gallium arsenide (GaAs) chips, which have seldom been discussed in any of the textbooks or publications in the area of thermal management of electronic equipment. With this new chapter, the book is complete and whole in the area of thermal design of electronics systems. With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume

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Holdings
Item type	Current library	Call number	Status	Notes	Date due	Barcode	Item holds
Costly Books	SNU LIBRARY	621.38104 YEH (Browse shelf(Opens below))	Not For Loan	Costly		28634

Total holds: 0

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1 Introduction --
2 Conduction --
3 Convection --
4 Radiation --
5 Pool Boiling --
6 Flow Boiling --
7 Condensation --
8 Extended Surfaces --
9 Thermal Interface Resistance --
10 Component and Printed Circuit Board --
11 Direct Air Cooling and Fans --
12 Natural and Mixed Convection --
13 Heat Exchangers and Cold Plates --
14 Advanced Cooling Technologies I: Single-Phase Liquid Cooling --
15 Advanced Cooling Technologies II: Two-Phase Flow Cooling --
16 Heat Pipes and Others --
17 Thermoelectric Devices --
18 Microwave Modules and GaAs Chips.

This Second Edition of a classic text is fully updated and greatly expanded, with in-depth revisions that include advancements in the component technology of microelectronics. The most noticeable one is the addition of an entirely new chapter on microwave modules and the gallium arsenide (GaAs) chips, which have seldom been discussed in any of the textbooks or publications in the area of thermal management of electronic equipment. With this new chapter, the book is complete and whole in the area of thermal design of electronics systems. With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume

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