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1121.
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An Introduction to Electronics Systems Packaging: Components of a CAD package and its highlights / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Components of a CAD package and its highlights
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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1122.
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An Introduction to Electronics Systems Packaging: Design Flow considerations; Beginning a circuit design with schematic work and component layout / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Design Flow considerations; Beginning a circuit design with schematic work and component layout
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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1123.
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An Introduction to Electronics Systems Packaging: Demo and examples of layout and routing; Technology file generation from CAD; DFM check list and design rules; Design for Reliability / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Demo and examples of layout and routing; Technology file generation from CAD; DFM check list and design rules; Design for Reliability
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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1124.
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An Introduction to Electronics Systems Packaging: Review of CAD output files for PCB fabrication; Photo plotting and mask generation / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Review of CAD output files for PCB fabrication; Photo plotting and mask generation
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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1125.
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An Introduction to Electronics Systems Packaging: Process flow-chart; Vias; PWB substrates / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Process flow-chart; Vias; PWB substrates
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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1126.
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An Introduction to Electronics Systems Packaging: Substrates continued; Video highlights; Surface preparation / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Substrates continued; Video highlights; Surface preparation
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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1127.
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An Introduction to Electronics Systems Packaging: Photoresist and application methods; UV exposure and developing; Printing technologies for PWBs / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Photoresist and application methods; UV exposure and developing; Printing technologies for PWBs
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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1128.
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An Introduction to Electronics Systems Packaging: PWB etching; Resist stripping; Screen-printing technology / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering PWB etching; Resist stripping; Screen-printing technology
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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1129.
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An Introduction to Electronics Systems Packaging: Through-hole manufacture process steps; Panel and pattern plating methods / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Through-hole manufacture process steps; Panel and pattern plating methods
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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1130.
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An Introduction to Electronics Systems Packaging: Video highlights on manufacturing; Solder mask for PWBs; Multilayer PWBs; Introduction to microvias / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Video highlights on manufacturing; Solder mask for PWBs; Multilayer PWBs; Introduction to microvias
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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1131.
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An Introduction to Electronics Systems Packaging: Microvia technology and Sequential build-up technology process flow for high-density interconnects / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Microvia technology and Sequential build-up technology process flow for high-density interconnects
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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1132.
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An Introduction to Electronics Systems Packaging: Conventional Vs HDI technologies; Flexible circuits; Tutorial session / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Conventional Vs HDI technologies; Flexible circuits; Tutorial session
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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1133.
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An Introduction to Electronics Systems Packaging: SMD benefits; Design issues; Introduction to soldering / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering SMD benefits; Design issues; Introduction to soldering
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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1134.
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An Introduction to Electronics Systems Packaging: Reflow and Wave Soldering methods to attach SMDs / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Reflow and Wave Soldering methods to attach SMDs
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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1135.
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An Introduction to Electronics Systems Packaging: Solders; Wetting of solders; Flux and its properties; Defects in wave soldering / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Solders; Wetting of solders; Flux and its properties; Defects in wave soldering
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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1136.
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An Introduction to Electronics Systems Packaging: "Vapour phase soldering, BGA soldering and Desoldering/Repair; SMT failures" / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering "Vapour phase soldering, BGA soldering and Desoldering/Repair; SMT failures"
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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1137.
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An Introduction to Electronics Systems Packaging: SMT failure library and Tin Whiskers / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering SMT failure library and Tin Whiskers
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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1138.
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An Introduction to Electronics Systems Packaging: Tin-lead and lead-free solders; Phase diagrams; Thermal profiles for reflow soldering; Lead-free alloys / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Tin-lead and lead-free solders; Phase diagrams; Thermal profiles for reflow soldering; Lead-free alloys
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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1139.
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An Introduction to Electronics Systems Packaging: Lead-free solder considerations; Green electronics; RoHS compliance and e-waste recycling issues / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Lead-free solder considerations; Green electronics; RoHS compliance and e-waste recycling issues
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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1140.
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An Introduction to Electronics Systems Packaging: Thermal Design considerations in systems packaging / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Thermal Design considerations in systems packaging
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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