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21.
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An Introduction to Electronics Systems Packaging: Electrical Issues � I; Resistive Parasitic / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Electrical Issues � I; Resistive Parasitic
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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22.
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An Introduction to Electronics Systems Packaging: Electrical Issues � II; Capacitive and Inductive Parasitic / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Electrical Issues � II; Capacitive and Inductive Parasitic
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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23.
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An Introduction to Electronics Systems Packaging: Electrical Issues � III; Layout guidelines and the Reflection problem / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Electrical Issues � III; Layout guidelines and the Reflection problem
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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24.
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An Introduction to Electronics Systems Packaging: Electrical Issues � IV; Interconnection / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Electrical Issues � IV; Interconnection
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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25.
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An Introduction to Electronics Systems Packaging: "Quick Tutorial on packages; Benefits from CAD; Introduction to DFM, DFR & DFT" / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering "Quick Tutorial on packages; Benefits from CAD; Introduction to DFM, DFR & DFT"
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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26.
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An Introduction to Electronics Systems Packaging: Components of a CAD package and its highlights / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Components of a CAD package and its highlights
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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27.
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An Introduction to Electronics Systems Packaging: Design Flow considerations; Beginning a circuit design with schematic work and component layout / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Design Flow considerations; Beginning a circuit design with schematic work and component layout
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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28.
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An Introduction to Electronics Systems Packaging: Demo and examples of layout and routing; Technology file generation from CAD; DFM check list and design rules; Design for Reliability / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Demo and examples of layout and routing; Technology file generation from CAD; DFM check list and design rules; Design for Reliability
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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29.
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An Introduction to Electronics Systems Packaging: Review of CAD output files for PCB fabrication; Photo plotting and mask generation / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Review of CAD output files for PCB fabrication; Photo plotting and mask generation
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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30.
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An Introduction to Electronics Systems Packaging: Process flow-chart; Vias; PWB substrates / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Process flow-chart; Vias; PWB substrates
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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31.
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An Introduction to Electronics Systems Packaging: Substrates continued; Video highlights; Surface preparation / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Substrates continued; Video highlights; Surface preparation
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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32.
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An Introduction to Electronics Systems Packaging: Photoresist and application methods; UV exposure and developing; Printing technologies for PWBs / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Photoresist and application methods; UV exposure and developing; Printing technologies for PWBs
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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33.
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An Introduction to Electronics Systems Packaging: PWB etching; Resist stripping; Screen-printing technology / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering PWB etching; Resist stripping; Screen-printing technology
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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34.
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An Introduction to Electronics Systems Packaging: Through-hole manufacture process steps; Panel and pattern plating methods / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Through-hole manufacture process steps; Panel and pattern plating methods
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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35.
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An Introduction to Electronics Systems Packaging: Video highlights on manufacturing; Solder mask for PWBs; Multilayer PWBs; Introduction to microvias / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Video highlights on manufacturing; Solder mask for PWBs; Multilayer PWBs; Introduction to microvias
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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36.
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An Introduction to Electronics Systems Packaging: Microvia technology and Sequential build-up technology process flow for high-density interconnects / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Microvia technology and Sequential build-up technology process flow for high-density interconnects
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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37.
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An Introduction to Electronics Systems Packaging: Conventional Vs HDI technologies; Flexible circuits; Tutorial session / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Conventional Vs HDI technologies; Flexible circuits; Tutorial session
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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38.
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An Introduction to Electronics Systems Packaging: SMD benefits; Design issues; Introduction to soldering / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering SMD benefits; Design issues; Introduction to soldering
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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39.
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An Introduction to Electronics Systems Packaging: Reflow and Wave Soldering methods to attach SMDs / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Reflow and Wave Soldering methods to attach SMDs
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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40.
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An Introduction to Electronics Systems Packaging: Solders; Wetting of solders; Flux and its properties; Defects in wave soldering / G.V. Mahesh by Series: NPTEL Lecture Series. Electrical Engineering Solders; Wetting of solders; Flux and its properties; Defects in wave soldering
Material type: Computer file Computer file; Format: electronic
Publication details: Bangalore Indian Insitiute of Science
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