Results of search for 'su:"Packaging."'

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1.	Image from Amazon.com Image from Google Jackets	Print and production finishes for packaging. :Edward Denison by ; Denison,Edward Material type: Text; Format: print ; Literary form: Not fiction Publisher number: ,Atlantic Publishers and distributors ,7/22, Ansari Road , Dariya Ganj New Delhi Publication details: ,Mies , Rotovision SA , 2008 Availability: Items available for loan: SNU LIBRARY (1)Call number: 688.8 DEN. Place hold Save to lists Add to cart (remove)
2.	Image from Amazon.com Image from Google Jackets	Packaging design :Chris van Uffelen by ; Uffelen, Chris van Material type: Text; Format: print ; Literary form: Not fiction Publisher number: ,Atlantic Publishers and distributors ,7/22, Ansari Road , Dariya Ganj New Delhi Publication details: ,Salenstein : Braun , 2013 Availability: Items available for reference: SNU LIBRARY: Not For Loan (1)Call number: 688.8 UFF. Save to lists Add to cart (remove)
3.	Image from Amazon.com Image from Google Jackets	Color Management : A Comprehensive Guide for Graphic Designers / John T Drew and Sarah A Meyer Material type: Text; Format: print ; Literary form: Not fiction Publisher number: , Atlantic Publishers and Distributors ,7/22, Ansari Road , Dariya Ganj New Delhi Publication details: Switzerland ; RotoVision , 2008 Availability: Items available for loan: SNU LIBRARY (1)Call number: 701.85 DRE. Place hold Save to lists Add to cart (remove)
4.	Image from Google Jackets	MEMS and Microsystems: Wafer Bonding & Packaging of MEMS / Santiram Kal by Kal, Santiram Series: NPTEL Lecture Series \| . Electronics And Communication Engineering \| . Wafer Bonding & Packaging of MEMS Material type: Text; Format: print ; Literary form: Not fiction Publication details: Kharagpur ; Indian Insitiute of Technology Online resources: Click here to access online Availability: No items available. Save to lists Add to cart (remove)
5.	Image from Google Jackets	MEMS and Microsystems: Wafer Bonding & Packaging of MEMS / Santiram Kal by Kal, Santiram Series: NPTEL Lecture Series. Electronics And Communication Engineering Wafer Bonding & Packaging of MEMS Material type: Text; Format: print ; Literary form: Not fiction Publication details: Kharagpur Indian Insitiute of Technology Online resources: Video Availability: Items available for loan: SNU LIBRARY (1). Place hold Save to lists Add to cart (remove)
6.	Image from Amazon.com Image from Google Jackets	Fundamentals of microfabrication : the science of miniaturization / Marc J. Madou by Madou, Marc J Edition: 2nd ed. Material type: Text; Format: print ; Literary form: Not fiction Publisher number: HCL Publication details: Boca Raton, Fla. CRC Press 2002 Availability: Not available: SNU LIBRARY: Withdrawn (1). Save to lists Add to cart (remove)
7.	Image from Google Jackets	An Introduction to Electronics Systems Packaging: Introduction and Objectives of the course / G.V. Mahesh by "Mahesh, G.V." Series: NPTEL Lecture Series. Electrical Engineering Introduction and Objectives of the course Material type: Computer file; Format: electronic Publication details: Bangalore Indian Insitiute of Science Online resources: Video Availability: Items available for loan: SNU LIBRARY (1). Place hold Save to lists Add to cart (remove)
8.	Image from Google Jackets	An Introduction to Electronics Systems Packaging: Definition of a system and history of semiconductors / G.V. Mahesh by "Mahesh, G.V." Series: NPTEL Lecture Series. Electrical Engineering Definition of a system and history of semiconductors Material type: Computer file; Format: electronic Publication details: Bangalore Indian Insitiute of Science Online resources: Video Availability: Items available for loan: SNU LIBRARY (1). Place hold Save to lists Add to cart (remove)
9.	Image from Google Jackets	An Introduction to Electronics Systems Packaging: Products and levels of packaging / G.V. Mahesh by "Mahesh, G.V." Series: NPTEL Lecture Series. Electrical Engineering Products and levels of packaging Material type: Computer file; Format: electronic Publication details: Bangalore Indian Insitiute of Science Online resources: Video Availability: Items available for loan: SNU LIBRARY (1). Place hold Save to lists Add to cart (remove)
10.	Image from Google Jackets	An Introduction to Electronics Systems Packaging: Packaging aspects of handheld products; Case studies in applications / G.V. Mahesh by "Mahesh, G.V." Series: NPTEL Lecture Series. Electrical Engineering Packaging aspects of handheld products; Case studies in applications Material type: Computer file; Format: electronic Publication details: Bangalore Indian Insitiute of Science Online resources: Video Availability: Items available for loan: SNU LIBRARY (1). Place hold Save to lists Add to cart (remove)
11.	Image from Google Jackets	An Introduction to Electronics Systems Packaging: "Case Study (continued); Definition of PWB, summary and Questions for review" / G.V. Mahesh by "Mahesh, G.V." Series: NPTEL Lecture Series. Electrical Engineering "Case Study (continued); Definition of PWB, summary and Questions for review" Material type: Computer file; Format: electronic Publication details: Bangalore Indian Insitiute of Science Online resources: Video Availability: Items available for loan: SNU LIBRARY (1). Place hold Save to lists Add to cart (remove)
12.	Image from Google Jackets	An Introduction to Electronics Systems Packaging: Basics of Semiconductor and Process flowchart; Video on �Sand-to-Silicon� / G.V. Mahesh by "Mahesh, G.V." Series: NPTEL Lecture Series. Electrical Engineering Basics of Semiconductor and Process flowchart; Video on �Sand-to-Silicon� Material type: Computer file; Format: electronic Publication details: Bangalore Indian Insitiute of Science Online resources: Video Availability: Items available for loan: SNU LIBRARY (1). Place hold Save to lists Add to cart (remove)
13.	Image from Google Jackets	An Introduction to Electronics Systems Packaging: "Wafer fabrication, inspection and testing" / G.V. Mahesh by "Mahesh, G.V." Series: NPTEL Lecture Series. Electrical Engineering "Wafer fabrication, inspection and testing" Material type: Computer file; Format: electronic Publication details: Bangalore Indian Insitiute of Science Online resources: Video Availability: Items available for loan: SNU LIBRARY (1). Place hold Save to lists Add to cart (remove)
14.	Image from Google Jackets	An Introduction to Electronics Systems Packaging: Wafer packaging; Packaging evolution; Chip connection choices / G.V. Mahesh by "Mahesh, G.V." Series: NPTEL Lecture Series. Electrical Engineering Wafer packaging; Packaging evolution; Chip connection choices Material type: Computer file; Format: electronic Publication details: Bangalore Indian Insitiute of Science Online resources: Video Availability: Items available for loan: SNU LIBRARY (1). Place hold Save to lists Add to cart (remove)
15.	Image from Google Jackets	An Introduction to Electronics Systems Packaging: "Wire bonding, TAB and flipchip-1" / G.V. Mahesh by "Mahesh, G.V." Series: NPTEL Lecture Series. Electrical Engineering "Wire bonding, TAB and flipchip-1" Material type: Computer file; Format: electronic Publication details: Bangalore Indian Insitiute of Science Online resources: Video Availability: Items available for loan: SNU LIBRARY (1). Place hold Save to lists Add to cart (remove)
16.	Image from Google Jackets	An Introduction to Electronics Systems Packaging: "Wire bonding, TAB and flipchip-2; Tutorials" / G.V. Mahesh by "Mahesh, G.V." Series: NPTEL Lecture Series. Electrical Engineering "Wire bonding, TAB and flipchip-2; Tutorials" Material type: Computer file; Format: electronic Publication details: Bangalore Indian Insitiute of Science Online resources: Video Availability: Items available for loan: SNU LIBRARY (1). Place hold Save to lists Add to cart (remove)
17.	Image from Google Jackets	An Introduction to Electronics Systems Packaging: Why packaging? & Single chip packages or modules (SCM) / G.V. Mahesh by "Mahesh, G.V." Series: NPTEL Lecture Series. Electrical Engineering Why packaging? & Single chip packages or modules (SCM) Material type: Computer file; Format: electronic Publication details: Bangalore Indian Insitiute of Science Online resources: Video Availability: Items available for loan: SNU LIBRARY (1). Place hold Save to lists Add to cart (remove)
18.	Image from Google Jackets	An Introduction to Electronics Systems Packaging: Commonly used packages and advanced packages; Materials in packages / G.V. Mahesh by "Mahesh, G.V." Series: NPTEL Lecture Series. Electrical Engineering Commonly used packages and advanced packages; Materials in packages Material type: Computer file; Format: electronic Publication details: Bangalore Indian Insitiute of Science Online resources: Video Availability: Items available for loan: SNU LIBRARY (1). Place hold Save to lists Add to cart (remove)
19.	Image from Google Jackets	An Introduction to Electronics Systems Packaging: Advances packages (continued); Thermal mismatch in packages; Current trends in packaging / G.V. Mahesh by "Mahesh, G.V." Series: NPTEL Lecture Series. Electrical Engineering Advances packages (continued); Thermal mismatch in packages; Current trends in packaging Material type: Computer file; Format: electronic Publication details: Bangalore Indian Insitiute of Science Online resources: Video Availability: Items available for loan: SNU LIBRARY (1). Place hold Save to lists Add to cart (remove)
20.	Image from Google Jackets	An Introduction to Electronics Systems Packaging: Multichip modules (MCM)-types; System-in-package (SIP); Packaging roadmaps; Hybrid circuits; Quiz on packages / G.V. Mahesh by "Mahesh, G.V." Series: NPTEL Lecture Series. Electrical Engineering Multichip modules (MCM)-types; System-in-package (SIP); Packaging roadmaps; Hybrid circuits; Quiz on packages Material type: Computer file; Format: electronic Publication details: Bangalore Indian Insitiute of Science Online resources: Video Availability: Items available for loan: SNU LIBRARY (1). Place hold Save to lists Add to cart (remove)